Ranging device
AssigneeSony Semiconductor Solutions Corporation
InventorsYOHTARO YASU, YOSHIKI EBIKO, YUYA MAEDA, HARUHIKO TERADA
Life of this patent
Estimating the term…
Abstract
A semiconductor device according to an embodiment of the present embodiment includes a stack including a silicon photonics layer and a supporting substrate that are bonded to each other. The silicon photonics layer includes a waveguide through which an optical signal is transmitted and a metal film disposed to be opposed to the supporting substrate with the waveguide interposed therebetween. The metal film includes a heater layer configured to serve as a heater for the waveguide.
Claims14
A semiconductor device comprising a stack including a silicon photonics layer and a supporting substrate that are bonded to each other, wherein
- the silicon photonics layer includes
- a waveguide through which an optical signal is transmitted, and
- a first metal film disposed to be opposed to the supporting substrate with the waveguide interposed therebetween, and
- the first metal film includes a first heater layer configured to serve as a heater for the waveguide.
A ranging device comprising:
- a light source chip that outputs an optical signal;
- a silicon photonics layer including a waveguide through which the optical signal output from the light source chip is transmitted, and a detector configured to detect a signal guided through the waveguide;
- a supporting substrate bonded to the silicon photonics layer;
- and
- a signal processing substrate that processes the signal detected by the detector, wherein
- the silicon photonics layer further includes a first metal film disposed to be opposed to the supporting substrate with the waveguide interposed therebetween, and
- the first metal film includes a first heater layer configured to serve as a heater for the waveguide.
Dependencies are inferred from the claim text.