Integrated circuit packaging configurations for terahertz active sensing
AssigneeTeraDar, Inc.
InventorsRuiyang Liu, Gregory L. Charvat, Nicholas Saiz, Matthew Carey, Volker Alois Blaschke
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AssigneeTeraDar, Inc.
InventorsRuiyang Liu, Gregory L. Charvat, Nicholas Saiz, Matthew Carey, Volker Alois Blaschke
Estimating the term…
Described herein are improved integrated transmitter and/or receiver circuits that may be implemented in a Terahertz-based active sensing system (e.g., operating. According to some embodiments, integrated transmitter and/or receiver circuits described herein may have a conductive layer including an antenna array and a semiconductor die with integrated circuitry disposed between the conductive layer and a substrate on which the integrated circuit is mounted. Some embodiments described herein exhibit high power gain in a compact footprint, which may increase the detection range of a Terahertz-based active sensing system on a given link budget.
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Dependencies are inferred from the claim text.