Wafer-level integrated magnets for back bias applications

A sensor comprising:

• a substrate having a cavity formed in a first main surface of the substrate;
• a first magnet that is formed in the cavity, the first magnet being arranged to at least partially fill the cavity;
• a first sensing bridge that is formed on a second main surface of the substrate, the second main surface being opposite to the first main surface, the first sensing bridge being arranged sense a magnetic field of the first magnet as the magnetic field is modulated by a rotating target and generate a sensing signal in response to the magnetic field.

A sensor comprising:

• a substrate having a cavity formed in a first main surface of the substrate and a mesa that extends from a bottom of the cavity;
• a first magnet that is formed in the cavity, the first magnet being arranged to surround the mesa, the first magnet being ring-shaped;
• one or more Hall elements that are formed on a second main surface of the substrate, the second main surface being opposite to the first main surface, the one or more Hall elements being arranged sense a magnetic field of the first magnet as the magnetic field is modulated by a rotating target and generate a sensing signal in response to the magnetic field.

An article of manufacture, comprising:

• a substrate having a cavity formed in a first main surface of the substrate;
• a first mesa that is formed in the cavity;
• a second magnet that is formed in the cavity, the second magnet being arranged to at least partially fill the cavity, the second magnet being arranged to surround the first mesa.