Circuit carrier, measurement application device and method

Abstract

The present disclosure shows a circuit carrier, comprising a carrier substrate comprising one or more inner layers, a carrier substrate having one or more first outer layers and one or more second outer layers, wherein the first outer layers and the second outer layers are arranged on opposite sides of the inner layers, and an internal recess, which extends from at least one of the first outer layers to at least one of the second outer layers through the inner layers, wherein the circuit carrier further comprises a heat dissipation element, which is arranged in the recess and has a first side facing the first outer layers, and a second side facing the second outer layers. Furthermore, the present disclosure shows a corresponding measurement application device and a corresponding method.

Dependencies are inferred from the claim text.