Bionic mechanical sensor
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorChun-Kai CHANG
Life of this patent
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Abstract
The present disclosure provides a bionic mechanical sensor. The bionic mechanical sensor includes a first rotatable region, a second rotatable region, an encapsulant, a plurality of sensors, and a conductive element. The encapsulant covers the first rotatable region and the second rotatable region and is exposed to an external environment. The plurality of sensors are within the first rotatable region and the second rotatable region. The conductive element is electrically connected to the plurality of sensors and embedded within the encapsulant.
Claims20
A bionic mechanical sensor, comprising:
- a first rotatable region and a second rotatable region;
- an encapsulant covering the first rotatable region and the second rotatable region and exposed to an external environment;
- a plurality of sensors within the first rotatable region and the second rotatable region;
- and
- a conductive element electrically connected to the plurality of sensors and embedded within the encapsulant.
A bionic mechanical sensor, comprising:
- a first rotatable region and a second rotatable region;
- an encapsulant covering the first rotatable region and the second rotatable region and configured to contact an object;
- a conductive element embedded within the encapsulant and connecting the first rotatable region and the second rotatable region;
- and
- a driver disposed between the first rotatable region and the second rotatable region and configured to control a relative motion between the first rotatable region and the second rotatable region.
A bionic mechanical sensor, comprising:
- an encapsulant having an outer surface configured to be in contact with or approaching an object;
- a sensing region configured to generate a signal in response to the object in contact with or approaching the encapsulant;
- and
- a mechanical module configured to deform the encapsulant in response to the signal,
- wherein the sensing region is closer to the outer surface of the encapsulant than the mechanical module is.
Dependencies are inferred from the claim text.