Method of Characterizing Layer Thickness
Assignee3M Innovative Properties Company
InventorsDavid L. Hofeldt, Jeffrey K. Eliason
Life of this patent
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Assignee3M Innovative Properties Company
InventorsDavid L. Hofeldt, Jeffrey K. Eliason
Estimating the term…
A method of characterizing thickness of at least one layer of a material includes irradiating the material with a THz pulse such that at least a portion of the THz pulse is reflected from the material as a reflected THz signal; acquiring a time-domain waveform of the reflected THz signal; fitting the time-domain waveform to a superposition of waveforms to determine pluralities of amplitudes and time shifts where each waveform in the superposition of waveforms is a reference waveform scaled by an amplitude in the plurality of amplitudes and time shifted by a time shift in the plurality of time shifts; and determining a proportional thickness of at least one layer of the material from a corresponding difference between two time shifts in the plurality of time shifts.
A method of characterizing thickness of at least one layer of a material, the method comprising:
Dependencies are inferred from the claim text.