Aluminum hydrocarbon coated pins plate

A thermally conductive interface structure comprising:

• an aluminum substrate,
• a plurality of pins formed integrally with the aluminum substrate, and a
• hydrocarbon coating disposed on the aluminum substrate and on the plurality of pins,
• wherein the hydrocarbon coating is deposited through a controlled polymerization process to produce a continuous conductive layer that conforms to curved pin surfaces and planar substrate surfaces,
• wherein the plurality of pins are arranged in a predetermined pattern on the aluminum substrate to define a high surface area conductive array, and
• wherein the aluminum substrate and the plurality of pins are configured to receive thermal energy from a thermoelectric semiconductor device along an oblique heat flow path established by a non-perpendicular mounting orientation of the thermoelectric semiconductor device relative to a cooled payload chamber, and to redistribute the received thermal energy laterally across the aluminum substrate and axially along the plurality of pins to enhance thermal spreading and increase heat rejection efficiency.

A thermally managed refrigeration interface system comprising:

• an aluminum payload chamber defining an interior cooled volume and comprising a hydrocarbon coated chamber wall forming a cold side thermal interface region;
• a thermoelectric semiconductor device mounted adjacent to the hydrocarbon coated chamber wall such that a cold side of the thermoelectric semiconductor device is in direct thermal communication with the hydrocarbon coated chamber wall and a hot side of the thermoelectric semiconductor device is oriented away from the payload chamber;
• an aluminum pin plate assembly positioned in direct thermal contact with the hot side of the thermoelectric semiconductor device, the aluminum pin plate assembly comprising an aluminum base plate and a plurality of pins formed integrally with the aluminum base plate, each pin extending into a downstream heat rejection region;
• a hydrocarbon composite coating disposed on the aluminum base plate and on the plurality of pins, the hydrocarbon composite coating being formed by thermally polymerizing a blended mixture of tetradecane and a polymer material to produce a wax like solid coating that continuously conforms to curved pin surfaces and planar base plate surfaces;
• wherein the plurality of pins are arranged in a predetermined high density array comprising approximately one hundred and twenty pins arranged at a center to center pitch of approximately 8.07 millimeters with each pin having a diameter of approximately five millimeters and a nominal height in a range from approximately thirty millimeters to approximately fifty millimeters;
• wherein the aluminum base plate is manufactured with a hole diameter tolerance of plus or minus 0.025 millimeters, a hole position tolerance of plus or minus 0.05 millimeters, a wall thickness tolerance of plus or minus 0.05 millimeters, and an outer dimension tolerance of plus or minus 0.1 millimeters, and further comprises standard M5 by 0.8 threaded mounting features configured to maintain controlled contact pressure against the hot side of the thermoelectric semiconductor device using mechanical fasteners;
• wherein the thermoelectric semiconductor device is mounted at a non perpendicular angle relative to the hydrocarbon coated chamber wall such that thermal energy enters the aluminum base plate of the aluminum pin plate assembly along an oblique heat flow path;
• and wherein thermal energy propagated from the payload chamber through the thermoelectric semiconductor device is redistributed laterally across the aluminum base plate and axially along the plurality of pins into a forced air or liquid cooled heat rejection region, thereby establishing bidirectional thermal conduction capability for operation in both cooling and heating modes while preventing thermal saturation of the thermoelectric semiconductor device during extended autonomous operation.