Method for slicing crystal material, method for manufacturing wafer, and member comprising crystal material

Abstract

A planar modified layer 3 including a first modified portion 2 is formed in a material 1 made of a crystal material at a plurality of places on the same plane at intervals, and subsequently, a second modified portion 7 is formed between the adjacent modified layers 3. Cracks generated in the adjacent modified layers 3 are joined by forming the second modified portion 7, and a thin plate 9 is peeled off from the material 1. The thin plate having a large area can be peeled off from the crystal material.

Dependencies are inferred from the claim text.