Curable resin composition and cured product thereof
AssigneeNippon Kayaku Kabushiki Kaisha
InventorsTakayuki TOHJIMA, Masanori HASHIMOTO, Masataka NAKANISHI
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Abstract
The present invention provides a curable resin composition having an excellent low dielectric loss tangent, and a cured product thereof. Provided is a curable resin composition containing a compound represented by formula (1) and a maleimide compound having a maleimide equivalent weight of from 450 g/eq to 2000 g/eq. In formula (1), the multiple R each independently represent a hydrogen atom, a C1 to 10 hydrocarbon group, or a C1 to 10 halogenated alkyl group. p represents an integer of 0 to 4, r represents an integer of 0 to 4, and q represents an integer of 0 to 3. n is the average number of repetitions and is 1≤n≤20.
Claims8
A curable resin composition comprising:
- a compound represented by the following formula (1);
- and
- a maleimide compound having a maleimide equivalent of 450 g/eq. or more and 2000 g/eq. or less:
- wherein, in formula (1),
- each of the multiple R independently represents a hydrogen atom, a hydrocarbon group having 1 to 10 carbon atoms, or a halogenated alkyl group having 1 to 10 carbon atoms,
- p represents an integer of 0 to 4,
- r represents an integer of 0 to 4, and
- q represents an integer of 0 to 3,
- n represents the average number of repetitions, and is 1≤n≤20.
Dependencies are inferred from the claim text.