Resist polymer, photosensitive resin composition, interlayer insulating film, and polymer production method

Abstract

The present disclosure provides a resist polymer and a photosensitive resin composition that are excellent in photocurability, alkali solubility, and heat resistance, as well as in thermomechanical properties and moisture resistance. The present disclosure relates to a resist polymer containing: a structural unit (A) derived from a maleimide-based monomer; a structural unit (B) derived from an aromatic monomer; and a structural unit (C) derived from an acid group-containing monomer, an amount of a structural unit (D) derived from a primary hydroxy group-containing monomer being less than 5% by mass based on 100% by mass of all structural units of the polymer, the polymer having an imide equivalent weight of 670 g/eq or less.

Dependencies are inferred from the claim text.