Compound, compound production method, curable resin composition, and cured product of same
AssigneeNippon Kayaku Kabushiki Kaisha
InventorsTakayuki TOHJIMA, Masato SEKI, Hiroki KONDO, Masanori HASHIMOTO
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AssigneeNippon Kayaku Kabushiki Kaisha
InventorsTakayuki TOHJIMA, Masato SEKI, Hiroki KONDO, Masanori HASHIMOTO
Estimating the term…
The present invention provides: a compound represented by formula (1) and having excellent low dielectric properties; a curable resin composition containing the compound; and a cured product thereof. In formula (1), R1's, which exist in a quantity of more than one, each independently represent a hydrogen atom or a hydrocarbon group having 1-5 carbon atoms. R2's, which exist in a quantity of more than one, each independently represent a hydrocarbon group represented by formula (a). l's, which exist in a quantity of more than one, each independently represent an integer of 1-4. m's, which exist in a quantity of more than one, each independently represent an integer of 0-4, and the average value mave of m satisfies 0<mave≤4. In formula (a), * represents the site of binding to a fluorene structure in formula (1). R3's, which exist in a quantity of more than one, each independently represent a hydrogen atom or a hydrocarbon group having 1-5 carbon atoms. E1 represents a direct bond or a methylene group. E2 and E3 each represent a hydrogen atom, a hydrocarbon group having 1-5 carbon atoms, or a substituted or unsubstituted phenyl group. n represents an integer of 1-5.
A compound represented by the following formula (1):
A compound obtained by reacting a compound represented by the following formula (A) with a compound represented by the following formula (B):
A method for producing a compound obtained by reacting a compound represented by the following formula (A) with a compound represented by the following formula (B) in an aprotic polar solvent in the presence of a basic catalyst:
Dependencies are inferred from the claim text.