US 2026/0273997 A1Published application

Method for forming three-dimensional wood grain on board surface, resulting board, and applications

AssigneeHangzhou Print Flooring Technology Co., Ltd.

InventorsGuocui Yang, Zhongshan Lei, Mengde Deng, Donghui Huang, Fangbing Ao, Feng Huang

Life of this patent

Estimating the term…

Loading patent…

Abstract

A method for forming three-dimensional (3D) embossed wood grain on the surface of a panel, comprising at least the following steps: applying a resin solution onto at least a portion of an ink layer surface and curing it to form a wood grain base layer; covering at least a portion of the wood grain base layer surface with at least one layer of resin solution; applying an embossing liquid onto at least a portion of the resin surface along the wood grain pattern of the ink layer to form an embossing layer; curing the areas of the resin solution other than the embossing layer and then removing the embossing layer, thereby forming a three-dimensional wood grain layer on the surface of the wood grain base layer.

Claims24

Dependent claims

A method for forming a three-dimensional wood grain on a surface of a board, characterized in that it comprises at least the following steps:

(S.1) covering at least a portion of the board surface with ink to form an ink layer having a wood grain pattern;
(S.2) covering at least a portion of the ink layer surface with a resin liquid;
(S.3) curing at least a portion of the resin liquid on the ink layer surface to form a wood grain base layer;
(S.4) covering at least a portion of the wood grain base layer surface with at least one layer of resin liquid;
(S.5) applying an embossing liquid to at least a portion of the resin liquid surface on the wood grain base layer along the wood grain pattern of the ink layer, such that the embossing liquid, and/or at least a portion of the resin liquid mixed with the embossing liquid, and/or at least a portion of the resin liquid covered by the embossing liquid forms an embossing layer;
(S.6) curing the resin liquid excluding the embossing layer formed in the previous step;
(S.7) removing the embossing layer to form a three-dimensional wood grain layer on the surface of the wood grain base layer.

4 more elements

Dependencies are inferred from the claim text.