Dendrite mitigation of passive components

A method comprising:

• forming a substrate including a polymer plug component positioned between a first conductive component and a second conductive component;
• mounting a system on chip (SoC) component to the substrate and electrically coupling the SoC to the substrate;
• mounting a first memory component to the substrate and electrically coupling the first memory component to the substrate;
• and
• mounting a second memory component to the substrate and electrically coupling the second memory component to the substrate.

A method comprising:

• forming a first conductive pin and a second conductive pin on an insulator substrate associated with a semiconductor device;
• forming a passivation layer over the first conductive pin, the second conductive pin, and the insulator substrate;
• forming a first electrode on the passivation layer, the first electrode electrically connected to the first conductive pin;
• forming a second electrode formed on the passivation layer, the second electrode electrically connected to the second conductive pin;
• forming a first insulating layer on the first electrode and forming a second insulating layer on the second electrode, wherein the first insulating layer and the second insulating layer are formed of a first insulator material and a cavity is formed between the first electrode and the second electrode by the first insulating layer and the second insulating layer;
• and
• forming an insulating plug in the cavity between the first electrode and the second electrode, wherein the insulating plug is formed of a second insulator material including an epoxy based material that applies a tensile force to the first insulating and the second insulating layers during a curing of the second insulator material.