Integrated circuit structure and method for fabricating the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYu-Xuan HUANG, Chi-Yu LU, Shang-Wen CHANG, Guan-Lin CHEN, Cheng-Chi CHUANG
Life of this patent
Estimating the term…
Loading patent…
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYu-Xuan HUANG, Chi-Yu LU, Shang-Wen CHANG, Guan-Lin CHEN, Cheng-Chi CHUANG
Estimating the term…
A method includes forming an epitaxial stack including a first sacrificial layer, a channel layer, and a second sacrificial layer over a semiconductor substrate; patterning the epitaxial stack into a fin structure such that opposite first ends of the channel layer are exposed; recessing the opposite first ends of the channel layer; forming first dummy spacers on the recessed opposite first ends of the channel layer; forming an isolation structure in the fin structure; recessing a top surface of the isolation structure to a position lower than a bottom surface of the channel layer, such that opposite second ends of the channel layer are exposed; recessing the opposite second ends of the channel layer; forming second dummy spacers on the recessed opposite second ends of the channel layer; and replacing the first dummy spacers and the second dummy spacers with a metal gate structure.
An integrated circuit structure, comprising:
An integrated circuit structure, comprising:
An integrated circuit structure, comprising:
Dependencies are inferred from the claim text.