Cooling device for cooling electronic components, use thereof and a method for its production

A cooling device for cooling electronic components, the cooling device comprising a housing with a coolant inlet and a coolant outlet and a coolant flow path through the housing from the coolant inlet to the coolant outlet, wherein the housing comprising a housing wall having an inner side in thermal contact with the coolant and an opposite outer side arranged for thermal contact with the electronic components for transfer of thermal energy from the electronic components through the housing wall and to the coolant;

• wherein the coolant flow path comprises a coolant supply canal connected to the coolant inlet, and a coolant drain canal connected to the coolant outlet, as well as multiple, mutually separate coolant branches, each branch having a branch inlet connected to the coolant supply canal and a branch outlet connected to the coolant drain canal without being connected through any of the other of the multiple branches, thereby forming individual coolant circuits through each of the branches;
• wherein the branches are distributed on the inner side of the housing wall for providing a homogeneous temperature profile in the housing wall and the electronic components, wherein each branch comprises a cavity and a flow-defining member inside the cavity, wherein the flow-defining member comprises flow-defining walls arranged for causing an intermeshed double-helical or double quasi-helical flow path of the coolant through the cavity for flow of coolant along a first flow path, which is a forward helical or quasi-helical flow path from a cavity inlet at a first end of the cavity to a second, opposite end of the cavity, where the flow is reversed for the coolant to enter a second flow path, which is a return helical or quasi-helical flow path in opposite direction relative to the first flow path, prior to flow of the coolant into the coolant drain canal.