Semiconductor device, power conversion device and moving body
AssigneeMitsubishi Electric Corporation
InventorRyutaro DATE
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Abstract
A semiconductor device according to the disclosure includes a base plate, a semiconductor chip provided in a region above the base plate, a case provided on the base plate, enclosing the semiconductor chip, including an outer surface and an inner surface on an opposite side of the outer surface, and including a recess formed on the outer surface, a nut pressed into the recess of the case and having a screw hole formed to extend in a vertical direction, and a screw inserted into the nut from below the base plate.
Claims14
A semiconductor device comprising:
- a base plate;
- a semiconductor chip provided in a region above the base plate;
- a case provided on the base plate, enclosing the semiconductor chip, including an outer surface and an inner surface on an opposite side of the outer surface, and including a recess formed on the outer surface;
- a nut pressed into the recess of the case and having a screw hole formed to extend in a vertical direction;
- and
- a screw inserted into the nut from below the base plate.
A semiconductor device comprising:
- a base plate;
- a semiconductor chip provided in a region above the base plate;
- a case provided on the base plate and enclosing the semiconductor chip;
- a nut provided on the case in a region enclosed by the case, the nut being a cap nut that is open downward;
- and
- a screw inserted into the nut from below the base plate.
The semiconductor device according to claim 1-92, wherein the nut is formed with an insulating body, and the screw is formed with a metal.
Dependencies are inferred from the claim text.