US 2026/0270598 A1 · MULTIPLE-SENSOR DIE ARRANGEMENT

Abstract

A sensor component can comprise a multi-sensor element arrangement comprising multiple sensor elements on a single die that can be attached to a top layer of a multi-layer component. The sensor elements can be associated with one or more ASICs on the top layer of the sensor component, and the ASIC(s) can be associated with other layers, including conductive terminals of the bottom layer, of the multi-layer component. The sensor component can be associated with a common bus, and the sensor elements and/or ASIC(s) can be respectively and individually addressed, configured, and/or controlled based on respective address, configuration, control, and/or other signals that can be received by the sensor component via the common bus. The sensor component can have a larger sound port and larger back volume that can be shared by the sensor elements to enhance acoustic performance.

Claims26

Dependent claims

A system, comprising:

a group of sensor elements comprising respective sensor elements formed on a single semiconductor die, wherein the group of sensor elements is configured to sense a condition;
and
a group of integrated circuits comprising respective integrated circuits configured to be associated with the respective sensor elements, wherein the respective integrated circuits, and the respective sensor elements via the respective integrated circuits, are configured to be associated with a single common bus.

Dependencies are inferred from the claim text.

Multiple-sensor die arrangement

Life of this patent

Multiple-sensor die arrangement

Life of this patent

Abstract

Claims26