Cover plate separation member and electronic device including same

An electronic device comprising:

• a frame;
• a cover plate positioned in a first direction with respect to the frame;
• an adhesive member positioned in at least a partial area between the frame and the cover plate and configured to bond the frame and the cover plate;
• and
• a cover plate separation member configured to be attachable in the first direction with respect to the cover plate,
• wherein the cover plate separation member comprises:
• a high thermal conductivity area which has a relatively high thermal conductivity and is positioned to at least partially overlap the adhesive member when the cover plate separation member is positioned on the cover plate, and
• a low thermal conductivity area which has a relatively low thermal conductivity compared to the high thermal conductivity area and is positioned to at least partially overlap an area of the electronic device, in which the adhesive member is not positioned when the cover plate separation member is positioned on the cover plate.

A method for separating a cover plate of an electronic device,

• wherein the electronic device comprises:
• a frame,
• a cover plate positioned in a first direction with respect to the frame, and
• an adhesive member positioned in at least a partial area between the frame and the cover plate and configured to bond the frame and the cover plate,
• wherein the method for separating a cover plate comprises:
• an attachment operation of attaching a cover plate separation member to the cover plate in a first direction,
• a heating operation of contacting a heat source to the cover plate separation member in the first direction,
• an adhesion release operation of inserting a wedge between the frame and the cover plate to remove adhesion of the adhesive member, and
• a separation operation of separating the cover plate from the frame, and
• wherein the cover plate separation member comprises:
• a high thermal conductivity area which has a relatively high thermal conductivity and is positioned to at least partially overlap the adhesive member when the cover plate separation member is positioned on the cover plate, and
• a low thermal conductivity area which has a relatively low thermal conductivity compared to the high thermal conductivity area and is positioned to at least partially overlap an area of the electronic device, in which the adhesive member is not positioned when the cover plate separation member is attached on the cover plate.