Electronic device
AssigneeSony Semiconductor Solutions Corporation
InventorTakashi IMAHIGASHI
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Abstract
An electronic device according to an embodiment includes a chip, a semiconductor substrate, bumps, an insulating film, and a metal film. The chip is provided with a semiconductor laser. The semiconductor substrate is provided with a drive circuit that drives the semiconductor laser. The bumps respectively connect a plurality of chip-side connection pads provided on a principal surface of the chip opposite to an emission surface of laser light, and a plurality of substrate-side connection pads provided on a principal surface of the semiconductor substrate on the side opposing the chip. The insulating film is provided in the same layer as the substrate-side connection pads, and insulates between the adjacent substrate-side connection pads. The metal film is provided on the insulating film.
Claims7
An electronic device comprising:
- a chip provided with a semiconductor laser;
- a semiconductor substrate provided with a drive circuit that drives the semiconductor laser;
- a plurality of bumps respectively connecting a plurality of chip-side connection pads provided on a principal surface of the chip opposite to an emission surface of laser light, and a plurality of substrate-side connection pads provided on a principal surface of the semiconductor substrate on a side facing the chip;
- an insulating film that is provided in an identical layer with the substrate-side connection pads and insulates between adjacent substrate-side connection pads among the substrate-side connection pads;
- and
- a metal film provided on the insulating film.
Dependencies are inferred from the claim text.