Power saving technique for single die multiple package scenarios

Abstract

A method for power saving in single die multiple package scenarios is describe. The method includes identifying used pads and unused pads of a system-on-chip (SoC) according to a pre-programmed value. The method also includes feeding a primary low power mode signal to the unused pads of the SoC during a low power mode of the SoC according to a first package type identified from the pre-programmed value. The method further includes feeding a secondary low power mode signal to the unused pads of the SoC during the low power mode and an active mode of the SoC according to a second package type identified from the pre-programmed value.

Dependencies are inferred from the claim text.