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US 2026/0266897 A1Published application
Prober
AssigneeTokyo Seimitsu Co., Ltd.
InventorTetsuo YOSHIDA
Life of this patent
Estimating the term…
Abstract
A prober 10 including a wafer chuck 16 holding a wafer W, a probe card 24 having a probe 25 on a surface facing the wafer chuck 16, movement mechanisms 13, 14, and 15 that move the wafer chuck 16 relative to the probe card 24, a probe imaging unit 18 that has two cameras 18L and 18R and takes images of a probe 25 by the two cameras 18L and 18R, and a probe position detector 27 that detects a position of a tip T of the probe 25 based on two images IL and IR taken by the two cameras 18L and 18R can quickly detect the position of the tip of the probe.
Claims6
A prober comprising:
- a wafer chuck that holds a wafer;
- a probe card that has a probe on a surface facing the wafer chuck;
- a movement mechanism that moves the wafer chuck relative to the probe card;
- a probe imaging unit that has two cameras and takes images of the probe by the two cameras;
- and
- a probe position detector that detects a position of a tip of the probe based on two images taken by the two cameras.
3 more elements
Dependencies are inferred from the claim text.