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US 2026/0266567 A1Published application
Cooling device
AssigneeNidec Corporation
InventorsTakehito TAMAOKA, Takaya OKUNO, Tadahiro KURAMOTO
Life of this patent
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Abstract
A cooling device includes a joint, a flow pipe, and a first cover. The joint includes a joint body and a first protruding portion. The joint body includes an internal flow path. The first protruding portion protrudes from the joint body, includes an internal flow path, and is fluidly connected to the joint body. The flow pipe is connected to the first protruding portion and is fluidly connected to the joint. The first cover covers an outer circumferential surface of a connection portion between the first protruding portion and the flow pipe.
Claims13
A cooling device comprising:
- a joint including:
- a joint body including an internal flow path;
- and
- a first protruding portion protruding from the joint body, including an internal flow path, and fluidly connected to the joint body;
- a flow pipe connected to the first protruding portion and fluidly connected to the joint;
- and
- a first cover to cover an outer circumferential surface of a connection portion between the first protruding portion and the flow pipe.
4 more elements
Dependencies are inferred from the claim text.