Three-dimension heat transfer device
AssigneePurple Cloud Development Pte. Ltd.
InventorsHua-Yuan LIN, Lei Lei LIU, Xiong ZHANG, Shao-Shuan KE, Munib Qasim ANSARI
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AssigneePurple Cloud Development Pte. Ltd.
InventorsHua-Yuan LIN, Lei Lei LIU, Xiong ZHANG, Shao-Shuan KE, Munib Qasim ANSARI
Estimating the term…
A three-dimensional heat transfer device configured to be thermally coupled to a heat source. The three-dimensional heat transfer device includes a thermally conductive casing having an airtight chamber and a thermal contact surface, the thermal contact surface faces away from the airtight chamber and is thermally coupled to the heat source, at least one first heat pipe disposed on the thermally conductive casing and in fluid communication with the airtight chamber, and at least one second heat pipe disposed on the thermally conductive casing and in fluid communication with the airtight chamber, wherein a cross-section of the first heat pipe is different from a cross-section of the second heat pipe, and the first heat pipe and the second heat pipe are configured to guide an airflow to a primary cooling area corresponding to the thermal contact surface.
A three-dimensional heat transfer device configured to be thermally coupled to a heat source, the three-dimensional heat transfer device comprising:
Dependencies are inferred from the claim text.