Flash-enhanced atomic layer deposition and chemical vapor deposition of metals

An apparatus for processing substrates, the apparatus comprising:

• one or more process chambers configured to receive a semiconductor substrate;
• one or more light sources configured above the semiconductor substrate;
• one or more gas inlets into the process chambers and associated flow-control hardware;
• and
• a controller having at least one processor and a memory, wherein:
• the at least one processor and the memory are communicatively connected with one another,
• the at least one processor is at least operatively connected with the associated flow-control hardware, and
• the memory stores computer-executable instructions for controlling the at least one processor to at least control the associated flow-control hardware to:
• cause emission of pulses of light from the one or more light sources to induce a transitory elevated temperature of a top surface of the semiconductor substrate and cause deposition of a metal-containing film on the semiconductor substrate.