Electronic substrate material, resin, and method for manufactoring resin
AssigneeIdemitsu Kosan Co., Ltd.
InventorsMomoe FUKITA, Kazunori CHIBA, Takaaki HIKOSAKA, Hironobu MORISHITA
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Abstract
An electronic substrate material containing a resin having a structure represented by Formula (UN1). In Formula (UN1): X represents a single bond, —O—, —S—, —SO—, —SO2—, or an organic group having 1 to 20 carbon atoms; and * each represent a bond.
Claims19
An electronic substrate material comprising a resin comprising a structure represented by Formula (UN1),
- where:
- X represents a single bond, —O—, —S—, —SO—, —SO2—, or an organic group having 1 to 20 carbon atoms;
- and * each represent a bond.
A resin comprising a structure represented by Formula (UN1), a terminal hydroxyl group content of the resin being 6,000 ppm by mass or less,
- where:
- X represents a single bond, —O—, —S—, —SO—, —SO2—, or an organic group having 1 to 20 carbon atoms;
- and * each represent a bond.
A method of producing a resin comprising a structure represented by Formula (UN1), the method comprising reacting a bischloroformate monomer or oligomer comprising a structure represented by Formula (UN1) with a bisphenol compound by interfacial polycondensation,
- where:
- X represents a single bond, —O—, —S—, —SO—, —SO2—, or an organic group having 1 to 20 carbon atoms;
- and * each represent a bond.
Dependencies are inferred from the claim text.