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US 2026/0265493 A1Published application
Molded polyimide article
OwnerHau-Nan Lee, Peter Fox +2inventors
InventorsHAU-NAN LEE, PETER FOX, LEE SILVERMAN, VIVEK KAPUR
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Abstract
Provided herein is a molded polyimide article having excellent insulating properties and mechanical properties, which is useful for electronic components. The molded polyimide article has lower than 5 of dielectric constant and at least 7.5 GPa of flexural modulus, and formed from a composition comprising (A) at least 30 weight % of at least one sheet silicate, based on the weight of the polyimide composition, and (B) at least one polyimide.
Claims7
A molded insulating polyimide article formed from a composition comprising
- (A) at least one polyimide, and
- (B) 30 to 70 weight % of at least one sheet silicate, based on the weight of the polyimide composition,
- wherein the dielectric constant of the molded insulating polyimide article is lower than 5 and the flexural modulus of the molded insulating polyimide article is at least 7.5 GPa.
Dependencies are inferred from the claim text.