Silica glass compression molding apparatus and method
AssigneesAdvanced Semiconductor Manufacturing Innovation Center, Wuxi Xishan District, Hunan University
InventorsShaohui YIN, Chengsong SHU, Xipeng GUO
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AssigneesAdvanced Semiconductor Manufacturing Innovation Center, Wuxi Xishan District, Hunan University
InventorsShaohui YIN, Chengsong SHU, Xipeng GUO
Estimating the term…
Disclosed are a silica glass compression molding apparatus, and a method. The silica glass compression molding apparatus comprises: a mold, a stamping component, a heating component, a cooling component and a braking component; the heating component comprises a heating chamber, an electromagnetic heating unit and an infrared heating unit. By means of forming a composite heating system with the electromagnetic heating unit and the infrared heating unit, the present apparatus can quickly raise the temperature in the heating chamber to over 1500° C. within 10 minutes under the action of the composite heating system, and the heating temperature is more uniform. Compared with existing compression molding devices, this solves the molding condition of current glass compression molding devices not being able to heat to a high temperature of 1500° C., and heating efficiency is high.
A silica glass compression molding apparatus, comprising:
Dependencies are inferred from the claim text.