1) A method for printing on bonded film materials having at least a layer of conductive material with a drying of ink using irradiation with electron beams, comprising:
- providing a bonded film material comprising at least a layer of conductive material interposed between at least two layers of insulating material, and arranging the bonded film material wound in a reel;
- predisposing a printing line, for printing the bonded film material at least at a respective outer layer,
- wherein the printing line comprises:
- an initial unwinding station, which is provided with a first reel holder shaft for receiving the reel of the bonded film material, wherein the printing line is configured to unwind the bonded film material from the reel and to advance the bonded film material according to an advancement direction;
- a series of printing stations, arranged consecutively to the initial unwinding station and, in succession, the other stations along the advancement direction of the bonded film material, configured to carry out printing processes on an outer layer of the bonded film material during the advancement thereof along the advancement direction;
- a drying station by means of irradiation of electron beams (EBeam), arranged downstream of the series of printing stations, configured to be crossed by the bonded film material and to irradiate the outer layer thereof on which the printing processes have been carried out so as to dry the ink printed thereon;
- a final winding station, comprising a second reel holder shaft, arranged downstream of the drying station and configured to wind the bonded film material in outlet from the drying station about the second reel holder shaft and form a second reel of printed bonded film material;
- the method being characterised in that it comprises:
- predisposing at least a conductive contact element conformed in such a way as to comprise at least a part having a cutting profile;
- predisposing a ground connection plant connected, on one side to the at least a conductive contact element, and on the other side to the ground surface;
- using the conductive contact element to at least partially score the bonded film material by means of the at least a part having a cutting profile in such a way that the part having a cutting profile reaches into contact with the at least a layer of conductive material of the bonded film material in such a way that the at least a layer of conductive material is in contact with the ground connection plant for discharging, to the ground surface, electrostatic loads which may have accumulated in the bonded film material.