Conformable sensors and methods of manufacturing conformable sensors

Abstract

Provided herein are conformable sensor assemblies and methods for manufacturing conformable sensor assemblies. In some embodiments, a method of manufacturing a conformable sensor assembly includes printing a high-resolution sensor element on a first layer using at least one of an electrohydrodynamic inkjet or an ultra-high resolution micro-dispensing process. The first layer comprises a flexible or a stretchable substrate. The method also includes printing a mid-resolution sensor element on a second sensor layer using at least one of an aerosol, inkjet jet, screen-printing, or copper etching process. The second sensor layer is made from a flexible or a stretchable substrate. The mid-resolution sensor element having a trace spacing in the range of about 20 microns to about 100 microns. The high-resolution sensor element has a trace spacing of less than about 20 microns. The first layer is coupled with the second sensor layer to form a sensor assembly.

Dependencies are inferred from the claim text.