Liquid ejection head
AssigneeRISO Technologies Corporation
InventorMasato FUKASAWA
Life of this patent
Estimating the term…
Abstract
A liquid ejection head includes a nozzle, a pressure chamber that communicates with the nozzle and stores a first liquid, an actuator configured to change a volume of the pressure chamber, a manifold unit that forms a first flow path running along the actuator and through which a temperature control liquid flows, a driving IC configured to drive the actuator, and a temperature adjustment structure that includes: a temperature control manifold that forms a second flow path running along the driving IC and through which the temperature control liquid flows, and a pair of temperature control blocks, one of which forms a branching flow path and the other of which forms a merging flow path. A heat conductivity of the pair of temperature control blocks is lower than a heat conductivity of the temperature control manifold.
Claims15
A liquid ejection head comprising:
- a nozzle plate including a nozzle through which a first liquid is ejected;
- a pressure chamber that communicates with the nozzle and stores the first liquid;
- an actuator configured to change a volume of the pressure chamber to eject the first liquid;
- a manifold unit that forms a first flow path running along the actuator and through which a temperature control liquid flows;
- a driving IC configured to drive the actuator;
- and
- a temperature adjustment structure that includes:
- a temperature control manifold that forms a second flow path running along the driving IC and through which the temperature control liquid flows, and
- a pair of temperature control blocks, one of the blocks forming a branching flow path through which the temperature control liquid flows into the first and second flow paths, and the other of the blocks forming a merging flow path by which the temperature control liquid from the first and second flow paths merges, wherein
- a heat conductivity of the pair of temperature control blocks is lower than a heat conductivity of the temperature control manifold.
Dependencies are inferred from the claim text.