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US 2026/0264299 A1Published application
Methods of injection molding with filament adhesive and equipment for injection molding with filament adhesives
Assignee3M Innovative Properties Company
InventorsEric Cybulski, Stephen R. Alexander, Shaun M. WEST, Jacob D. Young, Mark E. Napierala, Oliver Lingk, Mark F. Schulz, Ross E. Behling, Thomas Q. Chastek, Jeffrey C. Sexton
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Abstract
Methods of injection molding of a filament adhesive, where the filament adhesive is a pressure sensitive adhesive. Also, provided is equipment suitable for injection molding of a filament adhesive, where the filament adhesive is a pressure sensitive adhesive.
Claims21
A method of injection molding of a pressure sensitive adhesive, comprising:
- providing a filament adhesive wherein the filament adhesive is a pressure sensitive adhesive;
- providing a first substrate having a first major surface;
- providing a liner having at least one hole;
- providing a mold for holding the first substrate and for forming an adhesive layer;
- heating the filament adhesive to provide a molten composition;
- heating a flow channel;
- injection molding the molten filament adhesive composition through the heated flow channel and through the at least one hole in the liner;
- and
- molding an adhesive layer on the first major surface of the first substrate from the molten filament adhesive composition.
6 more elements
2-16. (canceled)
35-45. (canceled)
Dependencies are inferred from the claim text.