Control parameter setting method, substrate processing apparatus, and storage medium
AssigneeTokyo Electron Limited
InventorsToyohisa TSURUDA, Kazuhiro SHIBA, Naoto NAKAMURA
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AssigneeTokyo Electron Limited
InventorsToyohisa TSURUDA, Kazuhiro SHIBA, Naoto NAKAMURA
Estimating the term…
A control parameter setting method for setting control parameters of film forming modules included, includes: acquiring a first parameter group including control parameters for controlling a film forming process in a first film forming module, and a second parameter group including control parameters for controlling a film forming process in a second film forming module; acquiring a film thickness value of a processed film on a substrate subjected to film formation by the first film forming module based on the first parameter group, and a film thickness value of a processed film on a substrate subjected to film formation by the second film forming module based on the second parameter group; and updating the first parameter group and the second parameter group so that a difference between the film thickness values acquired in the first film forming module and the second film forming module is reduced.
A control parameter setting method for setting control parameters of film forming modules included in a substrate processing apparatus, comprising:
A substrate processing apparatus comprising:
Dependencies are inferred from the claim text.