Production of a lighting device

A method for producing a lighting device, the method comprising:

• providing a structured conversion element having separate conversion sections for radiation conversion arranged next to one another, wherein the conversion element comprises a carrier with recesses, which contain a conversion material, wherein the recesses of the carrier are through-recesses, and wherein a respective conversion section is formed by a recess of the carrier containing the conversion material;
• forming an emitter group of radiation-emitting semiconductor chips arranged on the conversion element at one side of the conversion element, wherein a radiation-emitting semiconductor chip is present in a region of each of the conversion sections;
• and
• forming a stabilization layer at least laterally with respect to and between the radiation-emitting semiconductor chips,
• wherein forming the emitter group on the conversion element is carried out subsequent to providing of the conversion element, and wherein forming the stabilization layer is carried out subsequent to forming the emitter group on the conversion element.

A lighting device comprising:

• a structured conversion element having separate conversion sections for radiation conversion arranged next to one another, wherein the conversion element comprises a carrier with recesses which contain a conversion material, wherein the recesses of the carrier are through-recesses, and wherein a respective conversion section is formed by a recess of the carrier containing the conversion material;
• an emitter group of radiation-emitting semiconductor chips arranged on the conversion element at one side of the conversion element, wherein a radiation-emitting semiconductor chip is present in a region of each of the conversion sections;
• and
• a stabilization layer arranged at least laterally with respect to and between the radiation-emitting semiconductor chips,
• wherein, at least in a region of lateral side walls of the radiation-emitting semiconductor chips, a transparent layer adjoining the radiation-emitting semiconductor chips is located, which comprises in the region of the side walls a layer surface running curved and/or obliquely with respect to the side walls of the radiation-emitting semiconductor chips, and
• wherein the stabilization layer adjoins the transparent layer and forms reflector structures surrounding the radiation-emitting semiconductor chips because of the layer surface of the transparent layer running curved and/or obliquely.

A method for producing a lighting device, the method comprising:

• providing a structured conversion element having separate conversion sections for radiation conversion arranged next to one another, wherein the conversion element comprises a carrier with recesses, which contain a conversion material, wherein the recesses of the carrier are through-recesses, and wherein a respective conversion section is formed by a recess of the carrier containing the conversion material;
• forming an emitter group of radiation-emitting semiconductor chips arranged on the conversion element at one side of the conversion element, wherein a radiation-emitting semiconductor chip is present in a region of each of the conversion sections;
• and
• forming a stabilization layer at least laterally with respect to and between the radiation-emitting semiconductor chips,
• wherein forming of emitter group on the conversion element comprises providing the radiation-emitting semiconductor chips as separate radiation-emitting semiconductor chips and arranging the separate radiation-emitting semiconductor chips on the conversion element.