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US 2026/0262233 A1Published application
Module and method for manufacturing same
AssigneeUltramemory Inc.
InventorsShigeru NAKAHARA, Fumitake OKUTSU, Masatoshi HASEGAWA, Kazuhiko KAJIGAYA, Kazuo KATO
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Abstract
A module includes a plurality of stacked memories. The plurality of stacked memories each includes memory chips stacked by bump-less connection, and a logic chip stacked on the stacked memories that are juxtaposed to each other in a direction intersecting with a stacking direction of the stacked memories in such a manner that the logic chip straddles the stacked memories.
Claims2
A module including a plurality of stacked memories, the module comprising:
- the plurality of stacked memories each including memory chips stacked by bump-less connection;
- and
- a logic chip stacked on the stacked memories that are juxtaposed to each other in a direction intersecting with a stacking direction of the stacked memories in such a manner that the logic chip straddles the stacked memories.
Dependencies are inferred from the claim text.