Customizable and modular cooling manifold for datacenter
AssigneeMellanox Technologies, Ltd.
InventorsShalom Alexander Gurevich, Yuval Blayer, Igal Gutman, Dikla Lidya Ben Joseph
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Abstract
Systems and methods disclosed herein are for cooling using segment cooling loops which may include manifold modules. The manifold modules may include individual outlets to direct a cooling fluid and may include lids at different ends of the manifold modules. The lids may reduce a flow velocity of the cooling fluid, by a predetermined threshold, at the individual outlets of the manifold modules.
Claims26
A cooling system, comprising:
- a plurality of manifold modules to be stacked together to provide a manifold in the cooling system;
- and
- a plurality of lids to enclose the plurality of manifold modules, wherein the plurality of manifold modules and the plurality of lids allow the cooling system to comprise different segment cooling loops comprising different manifold sizes or different manifold properties.
A plurality of segment cooling loops comprising a plurality of manifold modules, individual outlets of the plurality of manifold modules to direct a cooling fluid, and a plurality of lids at different ends of the plurality of manifold modules to reduce a flow velocity of the cooling fluid, by a predetermined threshold, at the individual outlets.
A manifold for a cooling loop, comprising:
- a plurality of manifold modules to couple together to form a passage for a cooling fluid;
- individual outlets of the plurality of manifold modules to form individual segment cooling loops to direct the cooling fluid from the manifold;
- and
- a plurality of lids at different ends of the passage to reduce a flow velocity of the cooling fluid, by a predetermined threshold, at the individual outlets.
A datacenter comprising:
- one or more racks comprising one or more server trays;
- one or more electronic components in the one or more server trays to perform at least part of a workload in the datacenter;
- and
- a plurality of segment cooling loops to remove heat from the electronic components during performance of the workload, the plurality of segment cooling loops comprising a plurality of manifold modules, individual outlets of the plurality of manifold modules to direct a cooling fluid, and a plurality of lids at different ends of the plurality of manifold modules to reduce a flow velocity of the cooling fluid, by a predetermined threshold, at the individual outlets.
A method for a cooling loop, comprising:
- coupling together a plurality of manifold modules to form a passage for a cooling fluid;
- forming individual segment cooling loops to direct the cooling fluid using individual outlets of the plurality of manifold modules;
- and
- using a plurality of lids at different ends of the passage to reduce at least a flow velocity of the cooling fluid, by a predetermined threshold, at the individual outlets.
Dependencies are inferred from the claim text.