Process chamber process kit with protective coating
AssigneeApplied Materials, Inc.
InventorJian WU
Life of this patent
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Abstract
A chamber component for a plasma process chamber and methods of fabricating and using the same are provided. In one aspect, a chamber component used within a plasma processing chamber is provided. The chamber component includes a metallic base material that has a surface having an average peak-to-valley distance, RzAVG, of less than or equal to about 20 micro inches, or about 0.508 microns. The chamber component also includes a silica coating formed over the surface.
Claims20
A chamber component used within a plasma processing chamber, comprising:
- a metallic base material comprising a surface, wherein the surface has an average peak-to-valley distance (RzAVG) of less than or equal to about 20 micro inches (0.508 microns);
- and
- a silica coating formed over the surface.
A method for fabricating a chamber component for use in a plasma processing environment, comprising:
- forming a body of the chamber component from a metal material, wherein the body has a roughened surface;
- machining the roughened surface to render a machined surface that has an average peak-to-valley distance (RzAVG) of less than or equal to about 20 micro inches (0.508 microns);
- depositing a layer of silica on the machined surface;
- and
- heating the layer of silica and the metal material.
A method, comprising:
- plasma treating a process chamber with a plasma containing nitrogen or oxygen, the process chamber including a chamber component comprising:
- a metallic base material comprising a surface that has an average peak-to-valley distance (RzAVG) of less than or equal to about 20 micro inches (0.508 microns);
- and
- a silica coating formed over the surface;
- placing a substrate into the process chamber, wherein a stack is disposed on the substrate;
- and
- plasma treating the stack disposed on the substrate.
Dependencies are inferred from the claim text.