Method for efficient dynamic sampling plan generation and accurate probe die loss projection

An apparatus for optimizing an inspection tool sampling plan, comprising:

• a memory storing a set of instructions;
• and
• at least one processor configured to execute the set of instructions to cause the apparatus to perform operations comprising:
• providing input data for a wafer to a computational defect probability prediction model;
• and
• distributing a sampling budget for a region of a wafer based on an expected number of defective die count for the region compared to an expected number of defective die count for the wafer;
• wherein the expected number of defective die count for the region is a summation of predicted defective die probability for the region and the expected number of defective die count for the wafer is a summation of predicted defective die probability for the wafer;
• and
• wherein the predicted defective die probability for the region and the predicted defective die probability for the wafer are obtained from the computational defect probability prediction model.

An apparatus for optimizing an inspection tool sampling plan, comprising:

• a memory storing a set of instructions;
• and
• at least one processor configured to execute the set of instructions to cause the apparatus to perform operations comprising:
• providing input data for a wafer to a computational defect probability prediction model;
• determining a defective die probability for each die of the wafer from the computational defect probability prediction model;
• generating a sampling plan;
• evaluating a wafer region from the defective die probability for each die of the wafer;
• evaluating a sampling budget distribution for each evaluated wafer region;
• and
• using the sampling plan with the evaluated wafer region and sampling budget distribution to guide wafer inspection of the wafer.