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US 2026/0259501 A1Published application
Photosensitive element, resist pattern formation method, and printed wiring board manufacturing method
AssigneeResonac Corporation
InventorsNatsuki TODA, Kenichi IWASHITA, Yosuke KAGUCHI, Hiroshi ONO
Life of this patent
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Abstract
A photosensitive element including a support film, a barrier layer, and a photosensitive layer in this order, in which the number of particles with a diameter of 0.8 μm or more measured on a surface of the support film on a barrier layer side is 100 or less per 0.0225 mm2.
Claims9
A photosensitive element comprising a support film, a barrier layer, and a photosensitive layer in this order, wherein
- a number of particles with a diameter of 0.8 μm or more measured on a surface of the support film on a barrier layer side is 100 or less per 0.0225 mm2.
Dependencies are inferred from the claim text.