Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, semiconductor device, and method for producing resin

A resin composition comprising:

• a resin having at least one repeating unit selected from the group consisting of a repeating unit represented by Formula (1-2), a repeating unit represented by Formula (1-3), and a repeating unit represented by Formula (1-4);
• a polymerization initiator;
• and
• a solvent,
• wherein an imidization rate of the resin is 40% to 85%,
• in Formula (1-2), A2 is —O— or —NRZ—, RZ is a hydrogen atom or a monovalent organic group, R2 is a hydrogen atom or a monovalent organic group, X2 is a tetravalent organic group, and Y2 is a divalent organic group,
• in Formula (1-3), A3 is —O— or —NRZ—, RZ is a hydrogen atom or a monovalent organic group, R3 is a hydrogen atom or a monovalent organic group, X3 is a tetravalent organic group, and Y3 is a divalent organic group, and
• in Formula (1-4), A41 and A42 are each independently —O— or —NRZ—, RZ is a hydrogen atom or a monovalent organic group, R41 and R42 are each independently a hydrogen atom or a monovalent organic group, X4 is a tetravalent organic group, and Y4 is a divalent organic group.