Method to image wafers and chiplet systems using ultrasonic arrays
AssigneeGeegah LLC
InventorsSerhan M. Ardanuc, Justin Kuo, Amit Lal
Life of this patent
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Abstract
An ultrasonic transducer technology consisting of a CMOS integrated piezoelectric transducers, that is wafer bonded to a high voltage drive capable transistor technology. This technology can be arranged in single chip, full wafer, and single line of chips to image bonded wafers to obtained defect and metrology data from the interface between wafers.
Claims21
An instrument comprising a plurality of chips each of which includes arrays of ultrasonic transducers, each of the transducers operating at frequencies greater than 100 MHz.
An imaging wafer comprising a plurality of sub areas, each of which comprises an ultrasonic imaging array of bulk-acoustic wave transducers formed with piezoelectric thin film, that has electrical interfaces to read out of the ultrasonic transmit/receive response of the transducers on the wafer.
A rectangular beam consisting of ultrasonic transducer arrays consisting of bulk acoustic wave transducers, with the ability to bend to conform on another bent surface.
Dependencies are inferred from the claim text.