Mechanical stress sensor

Abstract

An integrated circuit includes a semiconductor substrate including a plurality of electronic components. A plurality of metal interconnect layers is stacked on the semiconductor substrate to electrically connect the electronic components together. A sensing arrangement, formed in the plurality of metal interconnect layers, is configured to provide an output signal proportional to mechanical stress applied to the integrated circuit. The sensing arrangement includes a first sensing device at least partly formed by a metal interconnect layer of the plurality of metal interconnect layers. The first sensing device is arranged to produce a change in an electronic property of the first sensing device in response to a change in mechanical stress applied to the integrated circuit. A method of manufacturing an integrated circuit includes providing a semiconductor substrate and forming a plurality of metal interconnect layers on the substrate including the sensing arrangement.

Dependencies are inferred from the claim text.