Led backlight source and manufacturing method therefor

A manufacturing method for an LED backlight source, configured to manufacture a LED backlight source comprising a substrate, at least one LED chip and at least one driver integrated circuit (IC), wherein the substrate has a first side, the at least one LED chip and the at least one driver IC are disposed at intervals on the first side. M partitions are disposed on the first side, one driver IC and N channels are disposed in each partition, and one driver IC controls X LED chips through one channel, wherein M, N, and X are integers greater than or equal to 1, N is less than or equal to 6 and an appearance of the driver IC is white;

• the manufacturing method for the LED backlight source comprising:
• providing a substrate and a steel mesh, aligning the steel mesh with the substrate, and simultaneously applying solder paste to an LED pad and an IC pad of the substrate through the steel mesh, wherein an amount of solder paste on the LED pad and an amount of solder paste on the IC pad are different;
• and
• providing at least one LED chip and at least one driver IC with a white appearance, and soldering the at least one LED chip and the at least one driver IC respectively on the LED pad and the IC pad using reflow soldering to form the LED backlight source.

A manufacturing method for a light-emitting diode (LED) backlight source, configured to manufacture an LED backlight source comprising a substrate, at least one LED chip, and at least one driver integrated circuit (IC), wherein the substrate has a first side. the at least one LED chip and the at least one driver IC are disposed at intervals on the first side. M partitions are disposed on the first side, one driver IC and N channels are disposed in each partition, and one driver IC controls X LED chips through one channel, wherein M, N, and X are integers greater than or equal to 1, N is less than or equal to 6, and an appearance of the driver IC is white;

• the manufacturing method for the LED backlight source comprising:
• providing a substrate and a steel mesh, aligning the steel mesh with the substrate, and simultaneously applying solder paste to an LED pad and an integrated circuit (IC) pad of the substrate through the steel mesh, wherein an amount of solder paste on the LED pad and an amount of solder paste on the IC pad are different;
• providing an LED chip and a driver IC, and soldering the at least one LED chip and the at least one driver IC respectively on the LED pad and the IC pad using reflow soldering to form the LED backlight source;
• and
• coating each of the at least one driver IC with white glue, and drying the LED backlight source with the at least one driver IC in an oven to make the appearance of the driver IC white.