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US 2026/0258222 A1Published application
Compound, curable resin composition and cured product thereof
AssigneeNippon Kayaku Kabushiki Kaisha
InventorsTakayuki TOHJIMA, Kenichi KUBOKI, Masanori HASHIMOTO, Masataka NAKANISHI
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Abstract
The present invention provides a compound having excellent heat resistance and low dielectric properties, and a curable resin composition and a cured product thereof. The compound is obtained by reacting a compound represented by formula (a) with a compound having two or more amino groups per molecule. (In formula (a), Y represents a C1-20 hydrocarbon group.)
Claims9
A compound obtained by reacting a compound represented by following formula (a) with a compound having two or more amino groups in a molecule,
- (in above formula (a), Y represents a hydrocarbon group having 1 to 20 carbon atoms).
Dependencies are inferred from the claim text.