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US 2026/0257920 A1Published application
A dielectric material and method of forming the same
AssigneeNational University of Singapore
InventorsBarbaros OEZYILMAZ, Chee Tat TOH, Artem GREBENKO, Ugur KARADENIZ
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Abstract
A dielectric material and method of forming the same There is provided a dielectric material comprising a film comprising a layer of two-dimensional (2D) material, wherein the film has dielectric constant (κ)≤3.0. There is also provided a method of forming the dielectric material.
Claims23
A dielectric material comprising a film comprising a layer of two-dimensional (2D) material, wherein the film has dielectric constant (κ)≤3.0.
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Dependencies are inferred from the claim text.