Recycling tellurium and other materials utilized in teg manufacturing

Abstract

The recycling embodiments herein provide cyclical manufacturing of bulk semiconductor materials. In one embodiment, a method for recycling materials used in a semiconductor manufacturing process (e.g., a TEG manufacturing process) includes cutting one or more semiconductor wafers into a plurality of semiconductor components, and retrieving waste materials resulting from said cutting. The method also includes forming an ingot of semiconductor manufacturing material (e.g., tellurium) from the waste materials, and zone melting the ingot to remove impurities from the ingot.

Dependencies are inferred from the claim text.