Semiconductor devices and methods of manufacturing thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShu-Ling Liao, Te-En Cheng, Nai-Yu Yeh, Ming-Han Chung, Chunyao Wang, Yung-Cheng Lu
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShu-Ling Liao, Te-En Cheng, Nai-Yu Yeh, Ming-Han Chung, Chunyao Wang, Yung-Cheng Lu
Estimating the term…
A semiconductor device includes a metal gate. The semiconductor device further includes a first dielectric layer extending along a sidewall of the metal gate and including at least one of a plurality of cross-linked first silicon-oxygen-silicon backbones or a plurality of cross-linked first silicon-carbon-silicon backbones. The semiconductor device further includes a second dielectric layer extending along the first dielectric layer. The second dielectric layer extending along the first dielectric layer includes at least one of a plurality of cross-linked second silicon-oxygen-silicon backbones or a plurality of cross-linked second silicon-carbon-silicon backbones.
A semiconductor device, comprising:
A semiconductor device, comprising:
A semiconductor device, comprising:
Dependencies are inferred from the claim text.