Buffer structures for mitigation of defects at device interfaces and methods for preparing the same
AssigneeNanotronics Imaging, Inc.
InventorsPhilippe Bove, Matthew C. Putman
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AssigneeNanotronics Imaging, Inc.
InventorsPhilippe Bove, Matthew C. Putman
Estimating the term…
The present disclosure provides a method of forming a semiconductor device, including loading a substrate into a process chamber; depositing a first buffer layer over the substrate; depositing a delta doping layer on the first buffer layer; depositing a second buffer layer on the delta doping layer, wherein the first buffer layer, the delta doping layer, and the second buffer layer form a buffer structure; and depositing an active structure epitaxial layer on the second buffer layer. The method of the present disclosure can be used to mitigate defects, including charge trapping, at semiconductor device interfaces, and to compensate for distortion of the electric field at the interface between the substrate and the active structure epitaxial layer.
A method of forming a semiconductor device, comprising:
A method of epitaxially forming a semiconductor device, comprising:
A semiconductor device, comprising:
A vertically-oriented semiconductor device, comprising:
Dependencies are inferred from the claim text.