US 2026/0255545 A1 · ELECTRONIC DEVICE COMPRISING STRUCTURES FOR DISPERSING HEAT

Abstract

An electronic device is provided. The electronic device includes a display, an electronic component, and a heat spreading member disposed to at least partially overlap the electronic component when viewed from above the display, wherein the heat spreading member includes a first plate facing the electronic component, a second plate facing the first plate, a separating structure disposed in an internal space between the first plate and the second plate such that a first flow path and a second flow path are respectively formed along a first lateral surface and a second lateral surface opposite to the first lateral surface, and a wick structure for moving a fluid along at least one of the first flow path or the second flow path, wherein the wick structure includes a first wick portion located in the first flow path and the second flow path, and a second wick portion located over a portion of the first wick portion corresponding to the second flow path.

Claims20

Dependent claims

An electronic device comprising:

a display;
an electronic component;
and
a heat spreading member disposed to at least partially overlap the electronic component when viewed from above the display;
wherein the heat spreading member includes:
a first plate facing the electronic component;
a second plate substantially facing the first plate;
a separating structure disposed in an internal space between the first plate and the second plate such that a first flow path and a second flow path are respectively formed along a first lateral surface and a second lateral surface opposite to the first lateral surface thereof;
and,
a wick structure for moving a fluid along at least one of the first flow path or the second flow path;
and
wherein the wick structure includes:
a first wick portion located in the first flow path and the second flow path;
and
a second wick portion located over a portion of the first wick portion corresponding to the second flow path.

12 more elements

An electronic device comprising:

an electronic component;
and
a heat spreading member disposed at least partially on the electronic component;
and
wherein the heat spreading member includes:
a first region facing the electronic component,
a second region spaced apart from the first region,
a third region connecting the first region and the second region, the third region including a first flow path for a fluid in a gaseous state, and a second flow path for the fluid in a liquid state,
a frame including a separating structure in the third region separating the first flow path from the second flow path;
and
a wick structure for moving the fluid in the frame, and wherein the wick structure includes:
a first wick portion including a first portion disposed in the first region, a second portion disposed in the second region, and a third portion disposed in the third region and connecting the first portion and the second portion;
and
a second wick portion disposed in the second flow path and at least partially interposed between the third portion and the frame.

11 more elements

Dependencies are inferred from the claim text.

Electronic device comprising structures for dispersing heat

Life of this patent

Electronic device comprising structures for dispersing heat

Life of this patent

Abstract

Claims20