Microelectromechanical Systems (MEMS) Transducers for High Sound Pressure Level (SPL) Measurements
AssigneeShure Acquisition Holdings, Inc.
InventorJeffrey Peter Segota
Life of this patent
Estimating the term…
Abstract
Aspects of the disclosure relate to microelectromechanical systems (MEMS) devices for microphone applications. In particular, various examples herein describe techniques for limiting a diaphragm displacement of MEMS transducers to enable high sound pressure level (SPL) measurements. A reduced diaphragm displacement may be achieved by the use of an acoustic network, comprising an attenuator cavity, that may function to reduced an incident pressure on the diaphragm. The reduced diaphragm displacement may increase a maximum SPL handling capability of a MEMS transducer.
Claims20
A microphone system comprising:
- a first substrate;
- a microelectromechanical system (MEMS) microphone coupled to a top surface of the first substrate, wherein the MEMS microphone comprises a MEMS transducer mounted on a second substrate and enclosed by a lid, wherein the lid comprises an audio inlet into a front cavity of the MEMS microphone;
- and
- an attenuator lid coupled to a bottom surface of the first substrate, wherein:
- the attenuator lid and the first substrate encapsulate an attenuator cavity, and
- the front cavity of the MEMS microphone and the attenuator cavity are connected via a first opening in the first substrate and a second opening in the second substrate.
A microphone system comprising:
- a first substrate;
- a microelectromechanical system (MEMS) microphone coupled to a bottom surface of the first substrate, wherein the MEMS microphone comprises a MEMS transducer mounted on a second substrate and enclosed by a first lid;
- a second lid coupled to a top surface of the first substrate, wherein the second lid comprises an audio inlet into an inlet cavity encapsulated by the second lid and the first substrate, wherein the inlet cavity is connected to a first cavity of the MEMS microphone via a first opening in the first substrate;
- and
- an attenuator lid coupled to a bottom surface of the first substrate and enclosing the MEMS microphone, wherein:
- the attenuator lid and the first substrate encapsulate an attenuator cavity, and
- the inlet cavity and the attenuator cavity are connected via a second opening in the first substrate.
A microphone system comprising:
- a substrate;
- a microelectromechanical system (MEMS) transducer coupled to a bottom surface of the substrate;
- a lid coupled to a top surface of the substrate, wherein the lid comprises an audio inlet into an inlet cavity encapsulated by the lid and the substrate, wherein the inlet cavity is connected to a cavity of the MEMS transducer via a first opening in the substrate;
- and
- an attenuator lid coupled to a bottom surface of the substrate and enclosing the MEMS transducer, wherein:
- the attenuator lid and the substrate encapsulate an attenuator cavity, and
- the inlet cavity and the attenuator cavity are connected via a second opening in the substrate.
Dependencies are inferred from the claim text.