Method for manufacturing multilayer electronic component and method for manufacturing ceramic green sheet

Abstract

A method for manufacturing a multilayer electronic component includes applying a dielectric slurry onto a film and drying the dielectric slurry to form a ceramic green sheet; performing an HRP process on the ceramic green sheet to form a compressed ceramic green sheet; forming an internal electrode pattern on the compressed ceramic green sheet; forming a laminate by laminating the compressed ceramic green sheet having the internal electrode pattern formed thereon; forming a body including a dielectric layer and an internal electrode by sintering the laminate; and forming an external electrode on the body, wherein the HRP process applies a temperature of 50°C to 70°C and a pressure of 10 MPa to 20 MPa.

Dependencies are inferred from the claim text.